RED-BEET 2.0 - QCA Based PLC Module

8DEVICES Have Now Developed a New Series of Modules

As the demand for HomePlug Green Phy PLC Modules with improved features, such as a higher operating temperature range and improved quality control during production is increasing, CODICO and its long-standing partner 8DEVICES have now developed a new series of modules, based on QUALCOMM’s latest PLC-Chip - the QCA7006AQ -, that addresses the needs for electric vehicle charging applications (on both EV and EVSE). 

It provides best in class Analog Front End noise performance, thermal management with max. operating temperature of +105°C (ambient) and high quality by doing Automated Optical Inspection during manufacturing.

There are three different versions of the module available and despite primary focus on eMobility (EVSE and PEV) it also fits perfectly for smart grid, smart meter, IoT and other long-range communication applications.

• RED-BEET-H 2.0 (For IOT, smart grid/meter, long range PLC)
• RED-BEET-E 2.0 (For Electric Vehicle Supply Equipment – EVSE)
• RED-BEET-P 2.0 (For Plug-in Electric Vehicle -PEV)

All components on the module are AEC-Q100/200 Automotive qualified, making it suitable even for high-end automotive applications.

Features

• Based on QUALCOMM QCA7006AQ all-in-one, automotive-grade HPGP/HPAV PLC chip
• Compliant with ISO 15118-3, HPGP and HPAV standards
• Fully interoperable with IEEE 1901 specifications products
• Based on OFDM (Orthogonal Frequency Division Multiplexing) with 1.8MHz to 30MHz spectrum (2MHz to 28MHz on radiating wires and in eMobility)
• Extended PHY rate 9.8Mbps via HPGP (QPSK) and 200Mbps via HPAV (16, 64, 256, 1024QAM)
• Host interfaces SPI slave, Ethernet with embedded 10/100 Ethernet PHY, UART
• Extended operating temperature rage -40°C up to +105°C (ambient)
• Automotive Grade components used on module
• Serial Flash on module with latest HPAV/HPGP Firmware and configuration file (PIB)
• Available configurations EVSE, PEV and IoT/Home Control;
• Single power supply 3.3V DC with on-chip integrated power management unit
• Power consumption appr. 1W (SPI) / 1,2W (Ethernet) (both at +25° C)
• -95 dBm Analog Front End noise performance
• 23.3x23.3mm, 40-Pin package
• Castellated vias for enabling of AOI on host PCB, improved mechanical stability, simplified testing
• Optical Inspection to enhance product quality
• Long term availability

Your Contact Person

For more information, please contact Werner Reis.